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AN0013
15
Copyright 1997-2002 RF Micro Devices, Inc.
An example of some results of testing for NBB series and NDA series devices in each package style is given below for a
baseplate temperature of 85°C. The results shown are the average junction temperature of the sample measured.
Table 1. NBB Series Micro-X Packaged Junction Temperatures
Part
Number
Base
Temperature
oC
Low
Nominal
Limiting
Id
Tj
∆Tj
Id
Tj
∆Tj
Id
Tj
Tj
∆
mA
oC
oC
mA
oC
oC
mA
oC
oC
NBB-300
85
25
105.2
20.2
50
138.0
53.0
57
150.2
65.2
NBB-400
85
47
131.2
46.2
58
150.2
65.2
NBB-500
85
35
120.3
35.3
53
150.2
65.2
Table 2. NBB Series MPGA Packaged Junction Temperatures
Part
Number
Base
Temperature
oC
Low
Nominal
Limiting
Id
Tj
∆Tj
Id
Tj
∆Tj
Id
Tj
Tj
∆
mA
oC
oC
mA
oC
oC
mA
oC
oC
NBB-302
85
36
107.6
22.6
50
124.8
39.8
67
151.4
66.4
NBB-502
85
20
97.9
12.9
35
114.3
29.3
57
150.7
65.7
Table 3. NDA Series MPGA Packaged Junction Temperatures
Id1
Id2
Tj
∆Tj
Id1
Id2
Tj
∆Tj
Id1
Id2
Tj
∆Tj
mA
mA
oC
oC
mA
mA
oC
oC
mA
mA
oC
oC
NDA-212
85
29
36
133.1
48.1
32
55
150.4
65.4
NDA-312
85
28
36
133.9
48.9
29
42
139.9
54.9
31
55
151.0
66.0
NDA-412
85
29
36
140.0
55.0
Figure 2. NBB-300 Packaged Die Thermal Image
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