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S-7760A53XX-HCT1 Datasheet(PDF) 34 Page - Seiko Instruments Inc |
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S-7760A53XX-HCT1 Datasheet(HTML) 34 Page - Seiko Instruments Inc |
34 / 53 page PROGRAMMABLE PORT CONTROLLER (PORT EXPANDER WITH BUILT-IN E2PROM CIRCUIT) S-7760A Rev.1.3_00 Seiko Instruments Inc. 34 Precautions • Semiconductor devices must be used within the absolute maximum rating. Special caution is required for the supply voltage. A momentary surge voltage exceeding the rated value may cause latch-up and malfunction. Confirm the detailed usage conditions required for each parameter by referring to the data sheet before use. • If the S-7760A operates with moisture remaining in the circuits, a short circuit may occur between pins, causing a malfunction. When the S-7760A is taken out of the constant-low-temperature bath during evaluation, the pins of the S-7760A may be frosted. Note that, if the S-7760A is operated with the pins frosted, the pins may be short-circuited by moisture, causing a malfunction. The same applies when the S-7760A is used in an environment where condensation may occur, so care is required. • Although the IC contains a static electricity protection circuit, static electricity that exceeds the limit of the protection circuit should not be applied. • Seiko Instruments Inc. assumes no responsibility for the way in which this IC is used in products created using this IC or for the specifications of that product, nor does Seiko Instruments Inc. assume any responsibility for any infringement of patents or copyrights by products that include this IC either in Japan or in other countries. Precautions for WLP Package • The device’s silicon substrate side is exposed to the marking side of the device package. Since this portion has a lower strength against mechanical stress than a standard plastic package, take sufficient care to avoid chips and cracks when handling the package. Moreover, the exposed side of the silicon has the electrical potential of the device substrate, and needs to be kept out of contact with the external potential. • In this package, the transistor area side is overcoated with a translucent resin. Keep in mind that the characteristics of the package may be affected if the device is exposed under an intensive light source. |
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