NXP Semiconductors

SA58670

2.1 W/channel stereo class-D audio amplifier

© NXP B.V. 2008.

All rights reserved.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 4 January 2008

Document identifier: SA58670_1

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

18. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

5

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8

Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

9

Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

10

Typical performance curves . . . . . . . . . . . . . . . 7

11

Application information. . . . . . . . . . . . . . . . . . 16

11.1

Power supply decoupling considerations . . . . 16

11.2

Input capacitor selection . . . . . . . . . . . . . . . . . 16

11.3

PCB layout considerations . . . . . . . . . . . . . . . 17

11.4

Filter-free operation and ferrite bead filters. . . 17

11.5

Efficiency and thermal considerations . . . . . . 18

11.6

Additional thermal information . . . . . . . . . . . . 18

12

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19

13

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

13.1

Introduction to soldering . . . . . . . . . . . . . . . . . 20

13.2

Wave and reflow soldering . . . . . . . . . . . . . . . 20

13.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20

13.4

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21

14

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 22

15

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23

16

Legal information. . . . . . . . . . . . . . . . . . . . . . . 24

16.1

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24

16.2

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

16.3

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

16.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

17

Contact information. . . . . . . . . . . . . . . . . . . . . 24

18

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25