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STM32L412R8Y6TR Datasheet(PDF) 168 Page - STMicroelectronics |
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STM32L412R8Y6TR Datasheet(HTML) 168 Page - STMicroelectronics |
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168 / 192 page  Package information STM32L412xx 168/192 DS12469 Rev 4 Figure 41. UFBGA64 – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package recommended footprint e - 0.500 - - 0.0197 - F 0.700 0.750 0.800 0.0276 0.0295 0.0315 ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 95. UFBGA – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 Table 96. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm |
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