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SM5010 Datasheet(PDF) 3 Page - Nippon Precision Circuits Inc |
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SM5010 Datasheet(HTML) 3 Page - Nippon Precision Circuits Inc |
3 / 25 page SM5010 series SEIKO NPC CORPORATION —3 PAD LAYOUT (Unit: µm) PINOUT (Top view) PIN DESCRIPTION and PAD DIMENSIONS Chip size: 0.92 × 1.18mm Chip thickness: 300 ± 30µm Chip base: VDD level Q VDD XT VSS (0,0) (920,1180) X Y INHN XTN HA5010 1 XT VSS Q VDD 4 2 3 NC NC 8 7 6 5 XTN INHN Number Name I/O Description Pad dimensions [µm] XY 1 INHN I Output state control input. Standby mode when LOW, pull-up resistor built in. In the case of the 5010CL ×, the oscillator stops and Power-saving pull-up resistor is built-in to reduce current consumption at standby mode. 195 174.4 2 XT I Amplifier input. Crystal oscillator connection pins. Crystal oscillator connected between XT and XTN 385 174.4 3 XTN O Amplifier output. 575 174.4 4 VSS – Ground 765 174.4 5Q O Output. Output frequency (fO, fO/2, fO/4, fO/8, fO/16) determined by internal connection 757.6 1017.6 6 NC – No connection – – 7 NC – No connection – – 8 VDD – Supply voltage 165.4 1014.6 |
Similar Part No. - SM5010_06 |
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Similar Description - SM5010_06 |
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