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DEVICE INFORMATION

IEC PACKAGE CHARACTERISTICS

IEC 60664-1 RATINGS TABLE

IEC 60747-5-2 INSULATION CHARACTERISTICS

(1)

ISO7220A, ISO7220C, ISO7220M

ISO7221A, ISO7221C, ISO7221M

SLLS755F – JULY 2006 – REVISED AUGUST 2007

PARAMETER

TEST CONDITIONS

MIN

TYP MAX

UNIT

L(I01)

Minimum air gap (Clearance)

Shortest terminal-to-terminal distance through air

4.8

mm

SOIC-8

L(I02)

Minimum external tracking

Shortest terminal-to-terminal distance across the

4.3

mm

(Creepage)

package surface

CTI

Tracking resistance (Comparative

DIN IEC 60112 / VDE 0303 Part 1

≥175

V

Tracking Index)

Minimum Internal Gap (Internal

Distance through the insulation

0.008

mm

Clearance)

barrier tied together creating a two-terminal device,

Ω

Isolation resistance

Ω

Barrier capacitance Input to output

1

pF

Input capacitance to ground

1

pF

NOTE: Creepage and clearance requirements should be applied according to the specific equipment isolation

standards of an application. Care should be taken to maintain the creepage and clearance distance of a board

design to ensure that the mounting pads of the isolator on the printed circuit board do not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques

shown in the Isolation Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are

used to help increase these specifications.

PARAMETER

TEST CONDITIONS

SPECIFICATION

Basic isolation group

Material group

IIIa

Rated mains voltage

≤150 VRMS

I-IV

Installation classification

Rated mains voltage

≤300 VRMS

I-III

Rated mains voltage

≤400 VRMS

I-II

PARAMETER

TEST CONDITIONS

SPECIFICATION

UNIT

Maximum working insulation

560

voltage

V

Input to output test voltage

1050

100% Production test with t = 1 s, Partial discharge <5 pC

Transient overvoltage

t = 60 s

4000

Insulation resistance

Ω

Pollution degree

2

(1)

Climatic Classification 40/125/21

11

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