Pin Assignment

Pad Assignment

Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-256.65

357.34

4

228.70

-361.37

2

-256.65

-361.99

5

219.80

338.59

3

96.10

-378.15

6

88.89

332.15

Pad Description

Pad

No.

Pad

Name

I/O

Internal

Connection

Description

1

HF2

I/O

CMOS

Connect to an antenna coil for normal operation. Open for data programming.

2

HF1

I/O

CMOS

Connect to an antenna coil for normal operation. Data I/O for programming.

3

VSS

¾¾

Negative power supply, ground

4

CLK

I

CMOS

Open for normal operation. Clock input for programming.

5

VPA

I

¾

Open for normal operation. High voltage supplies input for programming.

6

VDD

¾¾

Open for normal operation, +5V supply input for programming.

Absolute Maximum Ratings

Supply Voltage (VDD) ...............................................6V

Storage Temperature ...........................

-50°Cto125°C

Supply Voltage (VPA) ..........................................12.5V

Operating Temperature ..............................0

°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed

in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

HT672A

Rev. 1.10

2

May 17, 2007

( 0 , 0 )

1

2

3

4

5

6

Chip size: 925

* The IC substrate should be connected to VSS in the

PCB layout artwork.

1

2

3

4

8

7

6

5

H F

N C

N C

H F I

V C C

V P P

C L K

G N D

H T 6 7 2 A

8 D I P - A

Note: The 8-pin DIP package type is supplied only

for engineering evaluation purposes and will not be

available in production volumes.