Model RFP-250375N6X50-2

Typical Performance

2

Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121

Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369

Power Derating

Suggested Mounting Procedures

SUGGESTED STRESS RELIEF METHODS

SCALE:

BOARD LOWER

THAN LEAD.

.025

(2 PLACES)

MIN.

1. Make sure that the devices are mounted on flat surfaces

(.001” under the device) to optimize the heat transfer.

2. Position device on mounting surface and solder in place

using an SN96 type solder.

3. Solder leads in place using an SN63 type solder with a

controlled temperature iron (700°F).

CASE TEMPERATURE —

°C

150

125

100

75

50

25

100

75

25

50

0

Available on Tape and Reel for Pick and Place Manufacturing.

RFP-250375N6X50-2