1. Make sure that the devices are mounted on flat surfaces

(.001" under the device) to optimize the heat transfer.

2. Drill & tap the heatsink for the appropriate thread size to be

used.

3. Coat heatsink with a minimum amount of high quality

silicone grease (.001" max. thickness).

4. Position device on mounting surface & secure using socket

head screws, flat & split washers. Torque screws to the

appropriate value. Make sure that the device is flat against

the heatsink. (Care should be taken to avoid upward

pressure of the leads towards the lid).

5. Solder leads in place using an SN63 type solder with a

controlled temperature iron (700°F).

Model RFP-20N50TPR

Typical Performance

2

Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121

Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369

Power Derating

Suggested Mounting Procedures

SUGGESTED STRESS RELIEF METHODS

(2 PLACES)

BOARD LOWER

THAN LEAD.

.025

SCALE:

MIN.

WITH LEAD.

BOARD EVEN

NOT RECOMMENDED APPLICATION

THAN LEAD.

BOARD LOWER

SCALE:

BOARD HIGHER

THAN LEAD.

CASE TEMPERATURE —

°C

150

125

100

75

50

25

100

75

25

50

0