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HSDL-3202 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard) |
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HSDL-3202 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard) |
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11 / 16 page  11 Pick and Place Misalignment Tolerance and Self-Alignment after Solder Reflow If the printed solder paste volume is adequate, the HSDL-3202 will self-align after solder reflow. Units should be properly reflowed in IR/hot air convection oven using the recommended reflow profile. The direction of board travel does not matter. Direction Definition Allowable Misalignment Direction Tolerance X ≤ 0.2 mm Y See text θ≤ ± 3 degrees Tolerance for X-axis Alignment of Castellation Misalignment of castellation to the land pad should not exceed 0.2 mm or about one-half the width of the castellation during placement of the unit. The castellations will self-align to the pads during solder reflow. Y θ X Tolerance for Rotational ( θ) Misalignment Mounted units should not be rotated more than ± 3 degrees with reference to center X-Y as shown in the direction definition. Units that are rotated more than ± 3 degrees will not self-align after solder reflow. Units with less than a ± 3 degree misalign- ment will self-align after solder reflow. Y-axis Misalignment of Castellation In the Y direction, the HSDL- 3202 does not self-align after solder reflow. Agilent recom- mends that the part be placed in line with the fiducial mark (mid- length of land pad). This will enable sufficient land length (minimum of 1/2 land length) to form a good joint. See the drawing below. Recommended Solder Paste/Cream Volume for Castellation Joints Based on calculation and experi- ment, the printed solder paste volume required per castellation pad is 0.22 cubic mm (based on either no-clean or aqueous solder cream types with typically 60% to 65% solid content by volume). Using the recommended stencil will result in this volume of solder paste. MINIMUM 1/2 THE LENGTH OF THE LAND PAD EDGE FIDUCIAL |
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