HSDL-3202 datasheet(9/16 Pages) HP

Part #	HSDL-3202

Description	IrDA짰 Data 1.3 Low Power Compliant 115.2 Kb/s Infrared Transceiver

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Manufacturer	HP [Agilent(Hewlett-Packard)]

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9

Recommended Metal Solder

Stencil Aperture

It is recommended that only a

0.152 mm (0.006 inch) or a

0.127 mm (0.005 inch) thick

stencil be used for solder paste

printing. This is to ensure

adequate printed solder paste

volume and no shorting. See the

table below the drawing for

combinations of metal stencil

aperture and metal stencil thick-

ness that should be used.

Aperture opening for shield pad

is 2.7 mm x 1.25 mm as per land

pattern.

Adjacent Land Keepout and Solder

Mask Areas

Adjacent land keepout is the

maximum space occupied by the

unit relative to the land pattern.

There should be no other SMD

components within this area.

0.2 mm is the minimum solder

resist strip width required to

avoid solder bridging adjacent

pads.

It is recommended that two

fiducial crosses be placed at mid-

length of the pads for unit

alignment.

Note: Wet/Liquid Photo-

Imageable solder resist/mask is

recommended.

Stencil Thickness, t (mm)

Aperture Size (mm)

Length, l

Width, w

0.152 mm

2.60

± 0.05

0.55

± 0.05

0.127 mm

3.00

± 0.05

0.55

± 0.05

APERTURES AS PER

LAND DIMENSIONS

l

w

t

0.2

3.0

8.2

2.6

SOLDER MASK

UNITS: mm

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HSDL-3202 Datasheet(PDF) 9 Page - Agilent(Hewlett-Packard)

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