HSDL-3202 datasheet(8/16 Pages) HP

Part #	HSDL-3202

Description	IrDA짰 Data 1.3 Low Power Compliant 115.2 Kb/s Infrared Transceiver

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Manufacturer	HP [Agilent(Hewlett-Packard)]

Direct Link	http://www.home.agilent.com

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8 / 16 page

8

Moisture Proof Packaging

The HDSL-3202 is shipped in

moisture proof packaging. Once

opened, moisture absorption

begins.

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

two days if stored at the recom-

mended storage conditions. If

times longer than two days are

needed, the parts must be stored

in a dry box.

Baking

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Baking should only be done once.

Recommended Storage Conditions

Storage

10

°C to 30°C

Temperature

Relative

below 60% RH

Humidity

Package

Temp.

Time

In reels

60

°C

≥48 hours

In bulk

100

°C

≥4 hours

125

°C

≥2 hours

150

°C

≥1 hour

Recommended Land Pattern

Solder Pad, Mask and Metal Stencil

METAL STENCIL

FOR SOLDER PASTE

PRINTING

LAND

PATTERN

PCB

STENCIL

APERTURE

SOLDER

MASK

0.60

1.25

1.75

1.35

0.10

0.475

1.425

2.375

3.325

CL

MOUNTING

CENTER

SHIELD

SOLDER PAD

FIDUCIAL

2.05

0.775

UNIT: mm

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HSDL-3202 Datasheet(PDF) 8 Page - Agilent(Hewlett-Packard)

HSDL-3202 Datasheet(HTML) 8 Page - Agilent(Hewlett-Packard)

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