9

• Wave soldering parameter must be set and maintain

according to recommended temperature and dwell

time in the solder wave. Customer is advised to daily

check on the soldering profile to ensure the soldering

profile used is always conforming to recommended

soldering condition.

Note:

1. PCB with different size and design (component density) will have

different heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the solder-

ing profile again prior to loading a new type of PCB.

2. Avago Technologies’ high brightness LED are using high effi-

ciency LED die with single wire bond as shown below. Customer

is advised to take extra precaution during wave soldering to

ensure that the maximum wave temperature is not exceeding

recommendation of 250 ° C. Over-stressing the LED during sol-

dering process might cause premature failure to the LED due to

delamination.

Precautions

Lead Forming:

• The leads of an LED lamp may be preformed or cut

to length prior to insertion and soldering into PC

board.

• If lead forming is required before soldering, care must

be taken to avoid any excessive mechanical stress

induced to LED package. Otherwise, cut the leads

of LED to length after soldering process at room

temperature. The solder joint formed will absorb the

mechanical stress of the lead cutting from traveling to

the LED chip die attach and wirebond.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to length

rather that doing it manually.

Soldering Condition:

• Care must be taken during PCB assembly and solder-

ing process to prevent damage to LED component.

• The closest manual soldering distance of the solder-

ing heat source (soldering iron’s tip) to the body is

1.59mm. Soldering the LED closer than 1.59mm might

damage the LED.

LED component

Lead size

Diagonal

Plated through

hole diameter

0.457 x 0.457mm

(0.018 x 0.018inch)

0.646 mm

(0.025 inch)

0.976 to 1.078 mm

(0.038 to 0.042 inch)

0.508 x 0.508mm

(0.020 x 0.020inch)

0.718 mm

(0.028 inch)

1.049 to 1.150mm

(0.041 to 0.045 inch)

Wave Soldering

Manual Solder

Dipping

Pre-heat temperature

105 °C Max.

-

Preheat time

30 sec Max

-

Peak temperature

250 °C Max.

260 °C Max.

Dwell time

3 sec Max.

5 sec Max

Note: Refer to application note AN1027 for more information

on soldering LED components.

1.59mm

AlInGaP Device

InGaN Device

• Recommended soldering condition:

Avago Technologies LED configuration

Note: Electrical connection between bottom surface of LED die and

the leadframe material through conductive paste or solder.

• If necessary, use fixture to hold the LED component

in proper orientation with respect to the PCB during

soldering process.

Note: In order to further assist customer in designing jig accurately

that fit Avago Technologies’ product, 3D model of the product is

available upon request.

• At elevated temperature, the LED is more susceptible

to mechanical stress. Therefore, PCB must be allowed

to cool down to room temperature prior to handling,

which includes removal of jigs, fixtures or pallet.

• Special attention must be given to board fabrication,

solder masking, surface plating and lead holes size

and component orientation to assure solderability.

• Recommended PC board plated through holes size for

LED component leads.

• Over sizing of plated through hole can lead to twisting

or improper LED placement during auto insertion. Un-

der sizing plated through hole can lead to mechanical

stress on the epoxy lens during clinching