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HSDL-3603 Datasheet(PDF) 15 Page - Agilent(Hewlett-Packard) |
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HSDL-3603 Datasheet(HTML) 15 Page - Agilent(Hewlett-Packard) |
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15 / 24 page  15 Figure 19. Solder paste stencil aperture. See Figure 18 t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.0 ± 0.05 0.12 ± 0.002 0.127 0.005 2.0 ± 0.05 0.15 ± 0.002 w, the width of aperture is fixed at 0.70 mm (0.027 inches) Aperture opening for shield pad is 2.50 mm x 1.51 mm as per land dimension. 1.3. Recommended Metal Solder Stencil Aperture It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure ad- equate printed solder paste vol- ume and no shorting. The following combination of metal stencil aperture and metal stencil thickness should be used: APERTURES AS PER LAND DIMENSIONS l w t (STENCIL THICKNESS) SOLDER PASTE METAL STENCIL |
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