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HSDL-3603 Datasheet(PDF) 12 Page - Agilent(Hewlett-Packard) |
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HSDL-3603 Datasheet(HTML) 12 Page - Agilent(Hewlett-Packard) |
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12 / 24 page  12 Reflow Profile The reflow profile is a straight- line representation of a nominal temperature profile for a convec- tive reflow solder process. The temperature profile is divided into four process zones, each with different ∆T/∆time tempera- ture change rates. The ∆T/∆time rates are detailed in the following table. The temperatures are mea- sured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3603 castellation I/O pins are heated to a temperature of 125 °C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4 °C per second to allow for even heating of both the PC board and HSDL-3603 castellation I/O pins. Process zone P2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 170 °C (338 °F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 230 °C (446°F) for optimum results. The dwell time above the liquidus point of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder 0 t-TIME (SECONDS) 200 170 125 100 50 50 150 100 200 250 300 150 183 230 P1 HEAT UP P2 SOLDER PASTE DRY P3 SOLDER REFLOW P4 COOL DOWN 25 R1 R2 R3 R4 R5 90 sec. MAX. ABOVE 183°C MAX. 245°C Maximum Process Zone Symbol ∆T ∆T/∆time Heat Up P1, R1 25˚C to 125˚C 4˚C/s Solder Paste Dry P2, R2 125˚C to 170˚C 0.5˚C/s Solder Reflow P3, R3 170˚C to 230˚C (245˚C max.) 4˚C/s P3, R4 230˚C to 170˚C –4˚C/s Cool Down P4, R5 170˚C to 25˚C –3˚C/s connections. Beyond a dwell time of 90 seconds, the intermetallic growth within the solder connec- tions becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 170 °C (338°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25 °C (77°F) should not exceed -3 °C per second maximum. This limitation is necessary to allow the PC board and HSDL-3603 castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-3603 transceiver. Figure 15. Reflow graph. |
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