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HSDL-3603 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard) |
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HSDL-3603 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard) |
11 / 24 page ![]() 11 Moisture Proof Packaging All HSDL-3603 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC level 4. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temperature Time In Reels 60˚C ≥ 48 hours In Bulk 100˚C ≥ 4 hours 125˚C ≥ 2 hours 150˚C ≥ 1 hour Baking should only be done once. Figure 14. Baking conditions. Recommended Storage Conditions Storage 10 °C to 30°C Temperature Relative Humidity below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than two days are needed, the parts must be stored in a dry box. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH PACKAGE IS OPENED LESS THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS NO BAKING IS NECESSARY YES NO NO YES |
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Similar Description - HSDL-3603 |
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