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HA13173H Datasheet(PDF) 22 Page - Renesas Technology Corp |
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HA13173H Datasheet(HTML) 22 Page - Renesas Technology Corp |
22 / 24 page HA13173H Rev.1.00 Jan 16, 2007 page 22 of 23 Protections 1. Overvoltage protection circuit The overvoltage protection circuit (surge protector) turns off all outputs without Vdd, when VB voltage is more than about 21 V. And the overvoltage protection circuit (surge protector) turns off Vdd output with other all outputs, when VB voltage is more than about 26 V. The VB ≥ 18 V condition, the stand by current increases. 2. Overcurrent protection circuit FREG_B (pin 2), ILM OUT (pin 4), CD OUT (pin 6), DSP OUT (pin 7), AUDIO OUT (pin 10), EXT OUT (pin 12), VDD OUT (pin 14) output circuits are built-in overcurrent protection circuit, based on the respective output current. 3. Thermal protection circuit A built-in thermal protection circuit (TSD: Thermal Shut Down) prevents thermal damage to the IC. All outputs except VDD (pin 14) and FREG (pin 2, 3) are switched off when the circuit operates, revert to the original state when the temperature drops to a certain level. 4. FREG operation FREG function needs external PNP transistor, feedback resistor, stability capacitor. If the external transistor become saturation level, the base current depend on IC specification, that is FREG_B (pin 2) maximum current specification. 5. We recommend to mount a bypass diode in your application if there is a mode where potential difference between each output and VB (pin 8), VBUP (pin 15) or GND (pin 1) is reversed from the normal state. 6. Header of IC (TAB) have to connect to GND. For mounting the header of IC on the heat sink with the screw, heat sink have to connect to GND. When header of IC mount with heat sink with holding parts (use conductive material), holding parts have to connect to GND. At this time, the holding parts mount with heat sink with the screw, or it must connect to header of IC. If users have question or request, please contact the vendor. 7. Soldering should be done within the soldering heat test standard of the IC, specifying that the lead wires, up to 1 to 1.5 mm off the IC body, are kept in solder at 260°C for 10 s and at 350°C for 3 s. Therefore give careful consideration in order to do not exceed the condition. In a soldering iron is used, use a soldering iron grounded and do not leak at the tip. 8. To keep stability regulation The stability capacitor should be no temperature dependability and no bias voltage dependability. ESR level should be bellow 10 W all temperature range. |
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