HA13173H

Rev.1.00 Jan 16, 2007 page 21 of 23

8. Header of IC (TAB) have to connect to GND.

For mounting the header of IC on the heat sink with the screw, heat sink have to connect to GND. When header of

IC mount with heat sink with holding parishes conductive material, holding parts have to connect to GND. At this

time, the holding parts mount with heat sink with the screw, or it must connect to header of IC. If users have

question or request, please contact the vendor.

Example of Recommendation about the Method of Connecting Header of IC to GND

Bad example

Header of IC and GND

are not connected.

There is a crevice or

the insulator is inserted.

NG

Header of IC is not

connected to GND.

NG

There is no heat sink.

NG

9. Soldering should be done within the soldering heat test standard of the IC, specifying that the lead wires, up to 1 to

1.5 mm off the IC body, are kept in solder at 260°C for 10 seconds (2 or less times) and at 350°C for 3 seconds.

Therefore give careful consideration in order to do not exceed the condition. In a soldering iron is used, use a

soldering iron grounded and do not leak at the tip.

Characteristics

1. When there may be the mode which VB, VBUP or GND, and each output reverse with a normal potential state in

application, it recommends attaching a diode for IC protection. When outputting the terminal of IC to the direct set

exterior, a diode is required in order to protect IC from incorrect contact on a battery and a GND line. Especially

EXTOUT is required.

2. In the parts shown in external part lineup, the value of a capacitor is the minimum value required in order to secure

the oscillation stability of IC. Please use the capacitor independent of temperature and bias. Moreover, please use

the capacitor whose ESR is 10

Ω or less in the operating temperature range.