TC1313

DS21974A-page 22

© 2005 Microchip Technology Inc.

10-Lead Plastic Micro Small Outline Package (UN) (MSOP*)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037 REF

F

Footprint

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-021

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

β

α

c

B

φ

.003

.006

-

.009

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

A

L

E1

D

A1

E

A2

.016

.024

.118 BSC

.118 BSC

.000

.030

.193 BSC

.033

MIN

p

n

Units

.020 TYP

NOM

10

INCHES

0.95 REF

-

0.23

.009

.012

0.08

0.15

-

-

0.23

0.30

MILLIMETERS*

0.50 TYP.

0.85

3.00 BSC

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

10

5°

15°

5°

15°

-

--

0°

-

8°

5°

-

5°

-

15°

15°

JEDEC Equivalent: MO-187

8°

0°

E

L

D

β

(F)

B

p

E1

n

φ

α

A2

1

2

c

A1

A

L1

-

-

--

* The MSOP package for the TC1313 has not been qualified at the time of this publication.

Contact your Microchip sales office for availability.