© 2006 Microchip Technology Inc.

DS21714E-page 19

MCP6546/6R/6U/7/8/9

5-Lead Plastic Package (LT) (SC-70)

0.30

0.15

.012

.006

B

Lead Width

0.18

0.10

.007

.004

c

Lead Thickness

0.30

0.10

.012

.004

L

Foot Length

2.20

1.80

.087

.071

D

Overall Length

1.35

1.15

.053

.045

E1

Molded Package Width

2.40

1.80

.094

.071

E

Overall Width

0.10

0.00

.004

.000

A1

Standoff

1.00

0.80

.039

.031

A2

Molded Package Thickness

1.10

0.80

.043

.031

A

Overall Height

0.65 (BSC)

.026 (BSC)

p

Pitch

5

5

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.

Notes:

JEITA (EIAJ) Standard: SC-70

Revised 07-19-05

* Controlling Parameter

Top of Molded Pkg to

Q1

.004

.016

0.10

0.40

Lead Shoulder

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

L

E1

E

c

D

1

B

p

A2

A

Q1

n

A1

Drawing No. C04-061

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging