© 2006 Microchip Technology Inc.

DS21714E-page 25

MCP6546/6R/6U/7/8/9

14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)

Foot Angle

φ

04804

8

15

12

0

15

12

0

β

Mold Draft Angle Bottom

15

12

0

15

12

0

α

Mold Draft Angle Top

0.51

0.42

0.36

.020

.017

.014

B

Lead Width

0.25

0.23

0.20

.010

.009

.008

c

Lead Thickness

1.27

0.84

0.41

.050

.033

.016

L

Foot Length

0.51

0.38

0.25

.020

.015

.010

h

Chamfer Distance

8.81

8.69

8.56

.347

.342

.337

D

Overall Length

3.99

3.90

3.81

.157

.154

.150

E1

Molded Package Width

6.20

5.99

5.79

.244

.236

.228

E

Overall Width

0.25

0.18

0.10

.010

.007

.004

A1

Standoff

§

1.55

1.42

1.32

.061

.056

.052

A2

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

A

Overall Height

1.27

.050

p

Pitch

14

14

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

2

1

D

p

n

B

E

E1

h

L

c

β

45

°

φ

α

A2

A

A1

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-065

§ Significant Characteristic

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging