www.ti.com

EXAMPLE STENCIL DESIGN

14X (1.85)

14X (0.45)

12X (0.65)

(7)

(R0.05) TYP

SSOP - 2 mm max height

DB0014A

SMALL OUTLINE PACKAGE

4220762/A 05/2024

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

SYMM

SYMM

1

7

8

14