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TDA4853 Datasheet(PDF) 15 Page - NXP Semiconductors |
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TDA4853 Datasheet(HTML) 15 Page - NXP Semiconductors |
15 / 60 page ![]() 1999 Jul 13 15 Philips Semiconductors Product specification I2C-bus autosync deflection controllers for PC/TV monitors TDA4853; TDA4854 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground. Notes 1. Machine model: 200 pF; 0.75 µH; 10 Ω. 2. Human body model: 100 pF; 7.5 µH; 1500 Ω. THERMAL CHARACTERISTICS QUALITY SPECIFICATION In accordance with “URF-4-2-59/601”; EMC emission/immunity test in accordance with “DIS 1000 4.6” (IEC 801.6). Note 1. Tests are performed with application reference board. Tests with other boards will have different results. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCC supply voltage −0.5 +16 V Vi(n) input voltage for pins: BIN −0.5 +6.0 V HSYNC, VSYNC, VREF, HREF, VSMOD and HSMOD −0.5 +6.5 V SDA and SCL −0.5 +8.0 V XRAY −0.5 +8.0 V Vo(n) output voltage for pins: VOUT2, VOUT1 and HUNLOCK −0.5 +6.5 V BDRV and HDRV −0.5 +16 V VI/O(n) input/output voltages at pins BOP and BSENS −0.5 +6.0 V Io(HDRV) horizontal driver output current − 100 mA Ii(HFLB) horizontal flyback input current −10 +10 mA Io(CLBL) video clamping pulse/vertical blanking output current −−10 mA Io(BOP) B+ control OTA output current − 1mA Io(BDRV) B+ control driver output current − 50 mA Io(EWDRV) EW driver output current −−5mA Io(FOCUS) focus driver output current −−5mA Tamb operating ambient temperature −20 +70 °C Tj junction temperature − 150 °C Tstg storage temperature −55 +150 °C VESD electrostatic discharge for all pins note 1 −150 +150 V note 2 −2000 +2000 V SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air 55 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VEMC emission test note 1 − 1.5 − mV immunity test note 1 − 2.0 − V |
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