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TDA4853 Datasheet(PDF) 55 Page - NXP Semiconductors |
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TDA4853 Datasheet(HTML) 55 Page - NXP Semiconductors |
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55 / 60 page  1999 Jul 13 55 Philips Semiconductors Product specification I2C-bus autosync deflection controllers for PC/TV monitors TDA4853; TDA4854 SOLDERING Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Suitability of through-hole mount IC packages for dipping and wave soldering methods Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. PACKAGE SOLDERING METHOD DIPPING WAVE DBS, DIP, HDIP, SDIP, SIL suitable suitable(1) |
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