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LTC2207-14 Datasheet(PDF) 25 Page - Linear Technology |
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LTC2207-14 Datasheet(HTML) 25 Page - Linear Technology |
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25 / 32 page  LTC2207-14/LTC2206-14 25 220714614fa Figure 14. Functional Equivalent Block Diagram of Internal Dither Circuit +– AIN– AIN+ S/H AMP DIGITAL SUMMATION OUTPUT DRIVERS MULTIBIT DEEP PSEUDO-RANDOM NUMBER GENERATOR 14-BIT PIPELINED ADC CORE PRECISION DAC CLOCK/DUTY CYCLE CONTROL CLKOUT OF D13 • • • D0 ENC DITHER ENABLE HIGH = DITHER ON, LOW = DITHER OFF DITH ENC ANALOG INPUT 22076 F14 LTC2207-14/LTC2206-14 number generator; the random number fed to the dither DAC is also subtracted from the ADC result. If the dither DAC is precisely calibrated to the ADC, very little of the dither signal will be seen at the output. The dither signal that does leak through will appear as white noise. The dither DAC is calibrated to result in less than 0.5dB elevation in the noise floor of the ADC, as compared to the noise floor with dither off. Grounding and Bypassing The LTC2207-14/LTC2206-14 require a printed circuit board with a clean unbroken ground plane; a multilayer board with an internal ground plane is recommended. The pinout of the LTC2207-14/LTC2206-14 has been optimized for a flowthrough layout so that the interaction between inputs and digital outputs is minimized. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, VCM, and OVDD pins. Bypass capacitors must be located as close to the pins as possible. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC2207-14/LTC2206-14 differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. Heat Transfer Most of the heat generated by the LTC2207-14/LTC2206- 14 is transferred from the die through the bottom-side exposed pad. For good electrical and thermal performance, the exposed pad must be soldered to a large grounded pad on the PC board. It is critical that the exposed pad and all ground pins are connected to a ground plane of sufficient area with as many vias as possible. APPLICATIONS INFORMATION |
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