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LTC2207-14 Datasheet(PDF) 14 Page - Linear Technology |
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LTC2207-14 Datasheet(HTML) 14 Page - Linear Technology |
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14 / 32 page  LTC2207-14/LTC2206-14 14 220714614fa SENSE (Pin 1): Reference Mode Select and External Reference Input. Tie SENSE to VDD to select the internal 2.5V bandgap reference. An external reference of 2.5V or 1.25V may be used; both reference values will set a full scale ADC range of 2.25V (PGA = 0). VCM(Pin2):1.25VOutput.Optimumvoltageforinputcom- mon mode. Must be bypassed to ground with a minimum of 2.2µF. Ceramic chip capacitors are recommended. VDD (Pins 3, 4, 12, 13, 14): 3.3V Analog Supply Pin. Bypass to GND with 0.1µF ceramic chip capacitors. GND (Pins 5, 8, 11, 15, 48): ADC Power Ground. AIN + (Pin 6): Positive Differential Analog Input. AIN – (Pin 7): Negative Differential Analog Input. ENC+ (Pin 9): Positive Differential Encode Input. The sampled analog input is held on the rising edge of ENC+. Internally biased to 1.6V through a 6.2k Ω resistor. Output data can be latched on the rising edge of ENC+. ENC– (Pin 10): Negative Differential Encode Input. The sampled analog input is held on the falling edge of ENC–. Internally biased to 1.6V through a 6.2k Ω resistor. By- pass to ground with a 0.1µF capacitor for a single-ended Encode signal. SHDN (Pin 16): Power Shutdown Pin. SHDN = low results in normal operation. SHDN = high results in powered down analog circuitry and the digital outputs are placed in a high impedance state. DITH (Pin 17): Internal Dither Enable Pin. DITH = low disables internal dither. DITH = high enables internal dither. Refer to Internal Dither section of this data sheet for details on dither operation. NC (Pins 18, 19): No Connect. D0-D13 (Pins 20-22, 26-28, 32-35 and 39-42): Digital Outputs. D13 is the MSB. OGND (Pins 23, 31 and 38): Output Driver Ground. OVDD (Pins 24, 25, 36, 37): Positive Supply for the Output Drivers. Bypass to ground with 0.1µF capacitor. CLKOUT– (Pin 29): Data Valid Output. CLKOUT– will toggle at the sample rate. Latch the data on the falling edge of CLKOUT–. CLKOUT+ (Pin 30): Inverted Data Valid Output. CLKOUT+ will toggle at the sample rate. Latch the data on the rising edge of CLKOUT+. OF (Pin 43): Over/Under Flow Digital Output. OF is high when an over or under flow has occurred. ⎯⎯O⎯E (Pin 44): Output Enable Pin. Low enables the digital output drivers. High puts digital outputs in Hi-Z state. MODE (Pin 45): Output Format and Clock Duty Cycle Stabilizer Selection Pin. Connecting MODE to 0V selects offset binary output format and disables the clock duty cycle stabilizer. Connecting MODE to 1/3VDD selects offset binary output format and enables the clock duty cycle sta- bilizer. Connecting MODE to 2/3VDDselects2’scomplement output format and enables the clock duty cycle stabilizer. Connecting MODE to VDD selects 2’s complement output format and disables the clock duty cycle stabilizer. RAND (Pin 46): Digital Output Randomization Selection Pin. RAND low results in normal operation. RAND high selects D1-D13 to be EXCLUSIVE-ORed with D0 (the LSB). The output can be decoded by again applying an XOR operation between the LSB and all other bits. This mode of operation reduces the effects of digital output interference. PGA(Pin47):ProgrammableGainAmplifierControlPin.Low selects a front-end gain of 1, input range of 2.25VP-P. High selects a front-end gain of 1.5, input range of 1.5VP-P. GND (Exposed Pad, Pin 49): ADC Power Ground. The ex- posed pad on the bottom of the package must be soldered to ground. PIN FUNCTIONS |
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