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CDCL1810RGZRG4 Datasheet(PDF) 6 Page - Texas Instruments |
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CDCL1810RGZRG4 Datasheet(HTML) 6 Page - Texas Instruments |
6 / 25 page www.ti.com DEVICE INFORMATION NC AV DD CLKP CLKN AV DD YP0 YN0 V DD YP1 YN1 V DD V SS ADD0 V DD YN7 YP7 V DD YN6 YP6 V DD YN5 YP5 V DD SDA 1 2 3 4 5 6 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 CDCL1810 NOTE:Exposedthermalpadmustbesolderedto V SS. CDCL1810 SLLS781A – FEBRUARY 2007 – REVISED MARCH 2007 48-PIN QFN (RGZ) (TOP VIEW) The CDCL1810 is available in a 48-pin QFN (RGZ) package with a pin pitch of 0,5mm. The exposed thermal pad serves both thermal and electrical grounding purposes. NOTE: The device must be soldered to ground (VSS) using as many ground vias as possible. The device performance will be severely impacted if the exposed thermal pad is not grounded appropriately. 6 Submit Documentation Feedback |
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