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NE555 Datasheet(PDF) 3 Page - NXP Semiconductors |
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NE555 Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 7 page Philips Semiconductors Linear Products Product specification NE/SA/SE555/SE555C Timer August 31, 1994 348 ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER RATING UNIT Supply voltage VCC SE555 +18 V NE555, SE555C, SA555 +16 V PD Maximum allowable power dissipation1 600 mW TA Operating ambient temperature range NE555 0 to +70 °C SA555 -40 to +85 °C SE555, SE555C -55 to +125 °C TSTG Storage temperature range -65 to +150 °C TSOLD Lead soldering temperature (10sec max) +300 °C NOTES: 1. The junction temperature must be kept below 125 °C for the D package and below 150°C for the FE, N and F packages. At ambient tempera- tures above 25 °C, where this limit would be derated by the following factors: D package 160 °C/W FE package 150 °C/W N package 100 °C/W F package 105 °C/W |
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