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AM29LV800DB120ED Datasheet(PDF) 46 Page - SPANSION

Part # AM29LV800DB120ED
Description  8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
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AM29LV800DB120ED Datasheet(HTML) 46 Page - SPANSION

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Am29LV800D
Am29LV800D_00_A7 December 4, 2006
D A TA
SH EET
REVISION SUMMARY
Revision A (January 19, 2004)
Changed data sheet status to Advance Information to
indicate new 0.23 µm process technology. The base
device part number has changed from Am29LV800B
to Am29LV800D. Specifications for I
CC1, t WHWH1,
t
WHWH2 have changed. Extended temperature is no
longer available. All other specifications in the data
sheet remain unchanged. Deleted references to KGD
option in Connection Diagrams section. (This docu-
ment was formerly released as publication 21490, revi-
sion H.)
Revision A+1 (February 3, 2004)
Distinctive Characteristics, General Description,
Ordering Information
Deleted references to KGD option. (This document
was formerly released as publication 21490, revision
H1.)
Revision A+2 (April 2, 2004)
General Description
Removed unlock bypass section.
Global
Converted datasheet to Preliminary.
Ordering Information
Added Pb-Free packages and updated Valid Combina-
tions tables to include changes.
Absolute Maximum Rating
Changed ambient with power applied from 125
°C to
85
°C.
Revision A+3 (June 23, 2004)
Global change
Changed all Helvetica/Times Roman fonts to Gill Sans
For AMD or Verdana.
“Physical Dimensions” on page 45
Added VBK048 Package Drawing.
“Ordering Information” on page 10
Added “WC =...” to Standard Products table.
Added “WCC, WCI, WCD, WCF” to Valid combinations
table.
Added Colophon.
Revision A+4 (January 21, 2005)
Added migration statement.
Revision A5 (February 16, 2006)
Updated migration statement on cover page and first
page of data sheet.
Removed Reverse TSOP material.
Updated trademarks.
Revision A6 (May 5, 2006)
Updated migration/obsolescence statement on cover
page and first page of data sheet.
Revision A7 (December 4, 2006)
AC Characteristics
Erase and Program Operations table: Changed t
BUSY
to a maximum specification.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 2004–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright © 2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are
trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.


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