Thermal Fuse & MOV (TFMOV)

Revision December 18, 2018

2 / 2

@ UN Semiconductor Co., Ltd. 2018

Specifications are subject to change without notice.

Please refer to www.unsemi.com.tw for current information.

Physical parameters

Unit: mm

Marking

32D511KTA

D

(max.)

36.0

H2

(max.)

41.0

T

(max.)

12.9

L

(min)

20.0

W1

(±1.0)

12.0

e1

(max)

4.3

d1

(±0.1)

1.2

d2

(±0.1)

1.2

Lead wire

Tinning copper wire

Comply with ROHS Directive

Coating

Blue insulated epoxy resin

Weight, g

20.92

Packing

■

Bulk

50pcs/bag

200pcs/box

400pcs/carton

□

Tape&Reel

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pcs/reel

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pcs/box

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pcs/carton

□

Ammopack

----

pcs/bag

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pcs/carton