Am29LV800B Known Good Die

11

SU P P L E MEN T

REVISION SUMMARY

Revision A (March 1997)

Initial release.

Revision B (January 1998)

Formatted to match current template. Updated Distinc-

tive Characteristics and General Description sections

using the current main data sheet. Updated for CS39

process technology.

Revision B+1 (March 1998)

Distinctive Characteristics

Changed read and program/erase current to match

data sheet.

Pad Description

Corrected signal names for pads 13–44. Replaced

values for all pad coordinates.

Revision C (November 1998)

Die Photograph, Pad Description, Ordering

Information, Physical Specifications,

Manufacturing Information

Updated for CS39S process technology.

Ordering Information

Changed waffle pack quantity to 140. Changed valid

combinations to reflect die revision 2.

Terms and Conditions

Replaced warranty with new version.

Revision D (December 1998)

Packaging Information

Added section. Moved orientation information from die

photograph into this section.

Revision D+1 (June 14, 1999)

Physical Specifications

Corrected the bond pad dimensions. Deleted Si from

the bond pad metalization specification.

Revision D+2 (July 2, 1999)

Ordering Information

The quantities for each packaging type is now listed.

Contacting AMD for this information is no longer

required.

Revision E (March 12, 2002)

Global

Added 80 ns speed.

Pad Description

Added table of pad locations relative to die center.

Manufacturing Information

Changed test facility to Penang, Malaysia (ACN2016).

Trademarks

Copyright © 2002 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.