PRECAUTION IN USE

Storage

Recommended storage environment

Temperature: 5℃ ~ 30℃ (41oF ~ 86oF)

Humidity: 60% RH Max.

Soldering

Use the conditions shown to the under figure.

t

t

L

P

t 25℃ to Peak

Time

ts Preheat

TSmin

TSmax

Ramp-UP

Critical Zone

T to TP

L

Ramp-down

T

T

P

L

25

Profile Feature

Lead-Based

Solder

Lead-Free Solder

Average Ramp-Up Rate (Tsmax to Tp)

3℃/second max.

3℃/second max.

Preheat: Temperature Min (Tsmin)

100℃

150℃

Preheat: Temperature Max (Tsmax)

150℃

200℃

Preheat: Time (Tsmin to Tsmax)

60-120 seconds

60-180 seconds

Time Maintained Above: Temperature (TL)

183℃

217℃

Time Maintained Above: Time (TL)

60-150 seconds

60-150 seconds

Peak/Classification Temperature (TP)

215℃

260℃

Time Within 5℃ of Actual Peak Temperature (TP)

10-30 seconds

20-40 seconds

Ramp-Down Rate

6℃/second max.

6℃/second max.

Time 25℃ to Peak Temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body

surface.

DATA SHEET

HIGH POWER

EH-3535W3FC120-OGVEZD34-A03A

6

EHAOAN Electronics Co., Ltd.

Dev.2013070408