Usage Precautions

Storage Environment Condition

Temperature: 5℃ ~ 30℃ (41℉ ~ 86℉ )

Humidity: 60% RH Max.

Soldering Condition

Use the conditions shown to the under figure.

t

t

L

P

t 25℃ to Peak

Time

ts Preheat

TSmin

TSmax

Ramp-UP

Critical Zone

T to TP

L

Ramp-down

T

T

P

L

25

Profile Feature

Lead-Based Solder

Average Ramp-Up Rate (Tsmax to Tp)

3℃/second max.

Preheat: Temperature Min (Tsmin)

100℃

Preheat: Temperature Max (Tsmax)

150℃

Preheat: Time (Tsmin to Tsmax)

60-120 seconds

Time Maintained Above: Temperature (TL)

183℃

Time Maintained Above: Time (TL)

60-150 seconds

Peak/Classification Temperature (TP)

225℃

Time Within 5℃ of Actual Peak Temperature (TP)

10-30 seconds

Ramp-Down Rate

6℃/second max.

Time 25℃ to Peak Temperature

6 minutes max.

Note:

All temperatures refer to topside of the package, measured on the package body surface.

EH-2525B2C-F120

DATA SHEET

High Power

EHAOAN Electronics Co., Ltd.

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