TLV2372IDGKG4 datasheet(17/31 Pages) TI

Part #	TLV2372IDGKG4

Description	FAMILY OF 550-uA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN

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Manufacturer	TI [Texas Instruments]

Direct Link	http://www.ti.com

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TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375

FAMILY OF 550 µA/Ch 3MHz RAILTORAIL INPUT/OUTPUT

OPERATIONAL AMPLIFIERS WITH SHUTDOWN

SLOS270D − MARCH 2001 − REVISED JANUARY 2005

17

WWW.TI.COM

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

general power dissipation considerations

For a given

θJA, the maximum power dissipation is shown in Figure 37 and is calculated by the following formula:

P

D +

T

MAX

–T

A

q

JA

Where:

PD

= Maximum power dissipation of TLV237x IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

TA

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case

θCA = Thermal coefficient from case to ambient air (°C/W)

1

0.75

0.5

0

−55 −40 −25 −10 5

1.25

1.5

MAXIMUM POWER DISSIPATION

vs

FREE-AIR TEMPERATURE

1.75

20 35 50

0.25

TA − Free-Air Temperature − °C

2

65 80 95 110 125

MSOP Package

Low-K Test PCB

θJA = 260°C/W

TJ = 150°C

PDIP Package

Low-K Test PCB

θJA = 104°C/W

SOIC Package

Low-K Test PCB

θJA = 176°C/W

SOT-23 Package

Low-K Test PCB

θJA = 324°C/W

NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.

Figure 37. Maximum Power Dissipation vs Free-Air Temperature

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TLV2372IDGKG4 Datasheet(PDF) 17 Page - Texas Instruments

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