3

EDS-102429 Rev C

Preliminary

303 South Technology Court

Phone: (800) SMI-MMIC

http://www.sirenza.com

Broomfield, CO 80021

SNA-200 DC-6.5 GHz Cascadable MMIC Amplifier

Typical Application Circuit

For recommended handling, die attach, and bonding methods, see the following application note at

www.sirenza.com.

AN-041 (PDF) Handling of Unpackaged Die

e

c

n

e

r

e

f

e

R

r

o

t

a

n

g

i

s

e

D

)

z

h

M

(

y

c

n

e

u

q

e

r

F

0

0

5

0

5

8

0

5

9

1

0

0

4

2

0

0

5

3

C

B

F

p

0

2

2F

p

0

0

1F

p

8

6F

p

6

5F

p

9

3

C

D

F

p

0

0

1F

p

8

6F

p

2

2F

p

2

2F

p

5

1

L

C

H

n

8

6H

n

3

3H

n

2

2H

n

8

1H

n

5

1

I

r

o

f

s

e

u

l

a

V

r

o

t

s

i

s

e

R

s

a

i

B

d

e

d

n

e

m

m

o

c

e

R

D

A

m

0

5

=

V

(

e

g

a

tl

o

V

y

l

p

p

u

S

6V

8V

0

1V

2

1

R

S

A

I

B

3

42

80

2

10

6

1

R

:

e

t

o

N

S

A

I

B

.

e

r

u

t

a

r

e

p

m

e

t

r

e

v

o

y

ti

li

b

a

t

s

s

a

i

b

C

D

s

e

d

i

v

o

r

p

RF in

RF out

1 uF

C

B

C

B

C

D

R

BIAS

L

C

1

2

3

4

1000

pF

SNA-200

Suggested Bonding Arrangement

(above configuration used for S-parameter data)

Part Number Ordering Information

r

e

b

m

u

N

t

r

a

P

k

c

a

P

l

e

G

0

0

2

-

A

N

Sk

c

a

p

r

e

p

.

s

c

p

0

0

1

Caution: ESD sensitive

Appropriate precautions in handling, packaging

and testing devices must be observed.

Die are shipped per Sirenza application note

AN-039 Visual Criteria For Unpackaged Die

Application Circuit Element Values

Simplified Schematic of MMIC