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FDPF20N50 Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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FDPF20N50 Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 10 page ©2007 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDP20N50 / FDPF20N50 Rev. B February 2007 UniFET TM FDP20N50 / FDPF20N50 500V N-Channel MOSFET Features • 20A, 500V, RDS(on) = 0.23Ω @VGS = 10 V • Low gate charge ( typical 45.6 nC) •Low Crss ( typical 27 pF) •Fast switching • 100% avalanche tested • Improved dv/dt capability Description These N-Channel enhancement mode power field effect transistors are produced using Fairchild’s proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction. Absolute Maximum Ratings Thermal Characteristics TO-220 FDP Series G S D TO-220F FDPF Series G S D D G S Symbol Parameter FDP20N50 FDPF20N50 Unit VDSS Drain-Source Voltage 500 V ID Drain Current - Continuous (TC = 25°C) - Continuous (TC = 100°C) 20 12.9 20 * 12.9 * A A IDM Drain Current - Pulsed (Note 1) 80 80 * A VGSS Gate-Source voltage ±30 V EAS Single Pulsed Avalanche Energy (Note 2) 1110 mJ IAR Avalanche Current (Note 1) 20 A EAR Repetitive Avalanche Energy (Note 1) 25 mJ dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns PD Power Dissipation (TC = 25°C) - Derate above 25 °C 250 2.0 62 0.5 W W/ °C TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C TL Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds 300 °C Symbol Parameter FDP20N50 FDPF20N50 Unit RθJC Thermal Resistance, Junction-to-Case 0.5 2.0 °C/W RθCS Thermal Resistance, Case-to-Sink Typ. 0.5 -- °C/W RθJA Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W * Drain current limited by maximum junction temperature |
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