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HSDL-3000 Datasheet(PDF) 10 Page - Agilent(Hewlett-Packard) |
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HSDL-3000 Datasheet(HTML) 10 Page - Agilent(Hewlett-Packard) |
10 / 16 page 10 Appendix A : HSDL-3000#007/#017 SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Solder Stencil Aperture Figure 1. Stencil and PCBA. METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA STENCIL APERTURE SOLDER MASK 1.1 Recommended Land Pattern for HSDL-3000 SHIELD SOLDER PAD a b f 6x PAD Y d e g Tx LENS Rx LENS FIDUCIAL X c FIDUCIAL theta DIM. mm INCHES a b c (PITCH) d e f g h 2.30 0.85 1.55 1.10 3.05 2.20 2.42 0.20 0.091 0.034 0.061 0.043 0.120 0.087 0.095 0.008 h Figure 2. Top view of land pattern. |
Similar Part No. - HSDL-3000 |
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Similar Description - HSDL-3000 |
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