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NCP1450ASN27T1 Datasheet(PDF) 21 Page - ON Semiconductor |
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NCP1450ASN27T1 Datasheet(HTML) 21 Page - ON Semiconductor |
21 / 22 page ![]() NCP1450A http://onsemi.com 21 1 3 GND CE 2 OUT NC 4 EXT 5 TP1 VIN TP4 GND TP3 VOUT TP2 GND C1 220 mF L1 10 mH JP1 C2 10 mF NTGS3446T1 ON OFF CE D1 MBRM110L Q1 IC1 1 3 GND CE 2 OUT NC 4 EXT 5 TP5 VIN TP6 GND TP7 VOUT TP8 GND C4 220 mF L2 10 mH JP2 C5 10 mF ON OFF CE D2 MBRM110L IC2 Q2 MMJT9410 Cb 3000 pF Rb 560 Figure 73. NCP1450A Evaluation Board Schematic Diagram 1 (Step−up DC−DC Converter Using External MOSFET Switch) Figure 74. NCP1450A Evaluation Board Schematic Diagram 2 (Step−up DC−DC Converter Using External Bipolar Transistor Switch) C3 0.1 mF C6 0.1 mF PCB Layout Hints Grounding One point grounding should be used for the output power return ground, the input power return ground, and the device switch ground to reduce noise. In Figure 73, e.g.: C2 GND, C1 GND, and IC1 GND are connected at one point in the evaluation board. The input ground and output ground traces must be thick enough for current to flow through and for reducing ground bounce. Power Signal Traces Low resistance conducting paths should be used for the power carrying traces to reduce power loss so as to improve efficiency (short and thick traces for connecting the inductor L can also reduce stray inductance), e.g.: short and thick traces listed below are used in the evaluation board: 1. Trace from TP1 to L1 2. Trace from L1 to anode pin of D1 3. Trace from cathode pin of D1 to TP3 Output Capacitor The output capacitor should be placed close to the output terminals to obtain better smoothing effect on the output ripple. Switching Noise Decoupling Capacitor A 0.1 mF ceramic capacitor should be placed close to the OUT pin and GND pin of the NCP1450A to filter the switching spikes in the output voltage monitored by the OUT pin. |
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