MURS205T3, MURS210T3

http://onsemi.com

4

PACKAGE DIMENSIONS

SMB

CASE 403A−03

ISSUE F

E

b

D

c

L1

L

A

A1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

2.261

0.089

2.743

0.108

2.159

0.085

mm

inches

SCALE 8:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.90

2.13

2.45

0.075

INCHES

A1

0.05

0.10

0.20

0.002

b

1.96

2.03

2.20

0.077

c

0.15

0.23

0.31

0.006

D

3.30

3.56

3.95

0.130

E

4.06

4.32

4.60

0.160

L

0.76

1.02

1.60

0.030

0.084

0.096

0.004

0.008

0.080

0.087

0.009

0.012

0.140

0.156

0.170

0.181

0.040

0.063

NOM

MAX

5.21

5.44

5.60

0.205

0.214

0.220

0.51 REF

0.020 REF

D

L1

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MURS205T3/D

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