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BUT11APX Datasheet(PDF) 1 Page - NXP Semiconductors |
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BUT11APX Datasheet(HTML) 1 Page - NXP Semiconductors |
1 / 8 page Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11APX GENERAL DESCRIPTION Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour television receivers. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT V CESM Collector-emitter voltage peak value V BE = 0 V - 1000 V V CBO Collector-Base voltage (open emitter) - 1000 V V CEO Collector-emitter voltage (open base) - 450 V I C Collector current (DC) - 5 A I CM Collector current peak value - 10 A P tot Total power dissipation T hs ≤ 25 ˚C - 32 W V CEsat Collector-emitter saturation voltage - 1.5 V I Csat Collector saturation current 3.5 - A t f Fall time I Csat=2.5A,IB1=0.5A,IB2=0.8A 145 160 ns PINNING - SOT186A PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 base 2 collector 3 emitter case isolated LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V CESM Collector to emitter voltage V BE = 0 V - 1000 V V CEO Collector to emitter voltage (open base) - 450 V V CBO Collector to base voltage (open emitter) - 1000 V I C Collector current (DC) - 5 A I CM Collector current peak value - 10 A I B Base current (DC) - 2 A I BM Base current peak value - 4 A P tot Total power dissipation T hs ≤ 25 ˚C - 32 W T stg Storage temperature -65 150 ˚C T j Junction temperature - 150 ˚C THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R th j-hs Junction to heatsink with heatsink compound - 3.95 K/W R th j-a Junction to ambient in free air 55 - K/W 12 3 case b c e September 1998 1 Rev 1.000 |
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