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TDA2030 Datasheet(PDF) 7 Page - STMicroelectronics |
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TDA2030 Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 12 page  PRACTICAL CONSIDERATIONS Printed circuit board The layout shown in Fig. 16 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows. Assembly suggestion No electrical isolation is needed between the package and the heatsink with single supply voltage configuration. Application suggestions The recommended values of the components are those shown on application circuit of fig. 13. Different values can be used. The following table can help the designer. Component Recomm. value Purpose Larger than recommended value Smaller than recommended value R1 22 k Ω Closed loop gain setting Increase of gain Decrease of gain (*) R2 680 Ω Closed loop gain setting Decrease of gain (*) Increase of gain R3 22 k Ω Non inverting input biasing Increase of input impedance Decrease of input impedance R4 1 Ω Frequency stability Danger of osccilat. at high frequencies with induct. loads R5 ≅ 3 R2 Upper frequency cutoff Poor high frequencies attenuation Danger of oscillation C1 1 µF Input DC decoupling Increase of low frequencies cutoff C2 22 µF Inverting DC decoupling Increase of low frequencies cutoff C3, C4 0.1 µF Supply voltage bypass Danger of oscillation C5, C6 100 µF Supply voltage bypass Danger of oscillation C7 0.22 µF Frequency stability Danger of oscillation C8 ≅ 1 2 π B R1 Upper frequency cutoff Smaller bandwidth Larger bandwidth D1, D2 1N4001 To protect the device against output voltage spikes (*) Closed loop gain must be higher than 24dB TDA2030 7/12 |
Similar Part No. - TDA2030_98 |
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Similar Description - TDA2030_98 |
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