www.ti.com

DESCRIPTION (CONTINUED)

ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATING TABLE

RECOMMENDED OPERATING CONDITIONS

TPA2012D2

SLOS438C – DECEMBER 2004 – REVISED MARCH 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

The TPA2012D2 is capable of driving 1.4 W/Ch at 5 V or 720 mW/Ch at 3.6 V into 8

Ω. The TPA2012D2 is also

capable of driving 4

Ω. The TPA2012D2 is thermally limited in WCSP and may not achieve 2.1 W/Ch for 4 Ω.

The maximum output power in the WCSP is determined by the ability of the circuit board to remove heat. The

output power versus load resistance graph below shows thermally limited region of the WCSP in relation to the

QFN package. The TPA2012D2 provides thermal and short circuit protection.

AVAILABLE OPTIONS

PACKAGE

PART NUMBER

SYMBOL

2 mm x 2 mm, 16-ball WCSP (YZH)

TPA2012D2YZH

AKR

–40

°C to 85°C

4 mm x 4 mm, 20-pin QFN (RTJ)

TPA2012D2RTJ

AKS

VALUE

UNIT

In active mode

–0.3 to 6.0

V

Supply voltage, AVDD, PVDD

In shutdown mode

–0.3 to 7.0

V

Input voltage

V

Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature range

–40 to 85

°C

Operating junction temperature range

–40 to 150

°C

Storage temperature range

–65 to 85

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DERATING

PACKAGE

FACTOR

POWER RATING

POWER RATING

RTJ

5.2 W

41.6 mW/

°C

3.12 W

2.7 W

YZH

1.2 W

9.12 mW/

°C

690 mW

600 mW

(1)

This data was taken using 2 oz trace and copper pad that is soldered directly to a JEDEC standard 4-layer 3 in

× 3 in PCB.

MIN

MAX

UNIT

Supply voltage

AVDD, PVDD

2.5

5.5

V

High-level input voltage

SDL, SDR, G0, G1

1.3

V

Low-level input voltage

SDL, SDR, G0, G1

0.35

V

Operating free-air temperature

÷40

85

°C

2

Submit Documentation Feedback