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EP1C12F100I8ES Datasheet(PDF) 5 Page - Altera Corporation |
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EP1C12F100I8ES Datasheet(HTML) 5 Page - Altera Corporation |
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5 / 104 page  Altera Corporation 1–3 January 2007 Preliminary Features Cyclone devices are available in quad flat pack (QFP) and space-saving FineLine® BGA packages (see Table 1–2 through 1–3). Vertical migration means you can migrate a design from one device to another that has the same dedicated pins, JTAG pins, and power pins, and are subsets or supersets for a given package across device densities. The largest density in any package has the highest number of power pins; you must use the layout for the largest planned density in a package to provide the necessary power pins for migration. For I/O pin migration across densities, cross-reference the available I/O pins using the device pin-outs for all planned densities of a given package type to identify which I/O pins can be migrated. The Quartus® II software can automatically cross-reference and place all pins for you when given a device migration list. If one device has power or ground pins, but these same pins are user I/O on a different device that is in the migration path,the Quartus II software ensures the pins are not used as user I/O in the Quartus II software. Ensure that these pins are connected to the appropriate plane on the board. The Quartus II software reserves I/O pins as power pins as necessary for layout with the larger densities in the same package having more power pins. Table 1–2. Cyclone Package Options & I/O Pin Counts Device 100-Pin TQFP (1) 144-Pin TQFP (1), (2) 240-Pin PQFP (1) 256-Pin FineLine BGA 324-Pin FineLine BGA 400-Pin FineLine BGA EP1C3 65 104 EP1C4 249 301 EP1C6 98 185 185 EP1C12 173 185 249 EP1C20 233 301 Notes to Table 1–2: (1) TQFP: thin quad flat pack. PQFP: plastic quad flat pack. (2) Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package) |
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