1N5820, 1N5821, 1N5822

http://onsemi.com

6

3.0

0.1

10

7.0

5.0

0.7

0.5

0.1

5.0

0.2

0.3

0.5

2.0

3.0

2.0

1.0

0.3

0.2

0.7 1.0

7.0 10

Figure 6. Forward Power Dissipation 1N5820−22

dc

SQUARE WAVE

SINE WAVE

I

(FM)

I

(AV)

+ p (Resistive Load)

Capacitive

Loads

5.0

10

20

)

NOTE 4 − APPROXIMATE THERMAL CIRCUIT MODEL

Use of the above model permits junction to lead thermal

resistance for any mounting configuration to be found. For

a given total lead length, lowest values occur when one side

of the rectifier is brought as close as possible to the heat sink.

Terms in the model signify:

(Subscripts (A) and (K) refer to anode and cathode sides,

respectively.) Values for thermal resistance components

are:

The maximum lead temperature may be found as follows:

where

for the mountings shown is to be used as typical guideline values

for preliminary engineering, or in case the tie point temperature

cannot be measured.

1

2

3

Mounting

Method

Lead Length, L (in)

1/8

1/4

1/2

3/4

50

51

53

55

°C/W

°C/W

°C/W

58

59

61

63

28

NOTE 5 — MOUNTING DATA

Mounting Method 1

P.C. Board where available

copper surface is small.

Mounting Method 3

P.C. Board with

2−1/2, x 2−1/2,

copper surface.

BOARD GROUND

PLANE

VECTOR PUSH−IN

TERMINALS T−28

Mounting Method 2

LL

LL

L = 1/2

″