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BU2527DX Datasheet(PDF) 1 Page - NXP Semiconductors |
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BU2527DX Datasheet(HTML) 1 Page - NXP Semiconductors |
1 / 7 page ![]() Philips Semiconductors Product specification Silicon Diffused Power Transistor BU2527DX GENERAL DESCRIPTION New generation, high-voltage, high-speed switching npn transistor with integrated damper diode in a plastic full-pack envelope intended for use in horizontal deflection circuits of high resolution monitors. Features improved RBSOA performance. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT V CESM Collector-emitter voltage peak value V BE = 0 V - 1500 V V CEO Collector-emitter voltage (open base) - 800 V I C Collector current (DC) - 12 A I CM Collector current peak value - 30 A P tot Total power dissipation T hs ≤ 25 ˚C - 45 W V CEsat Collector-emitter saturation voltage I C = 8.0 A; IB = 1.6 A - 5.0 V I Csat Collector saturation current f = 64 kHz 6.0 - A t s Storage time I Csat = 6.0 A; f = 64 kHz 1.7 2.0 µs PINNING - SOT399 PIN CONFIGURATION SYMBOL PIN DESCRIPTION 1 base 2 collector 3 emitter case isolated LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V CESM Collector-emitter voltage peak value V BE = 0 V - 1500 V V CEO Collector-emitter voltage (open base) - 800 V I C Collector current (DC) - 12 A I CM Collector current peak value - 30 A I B Base current (DC) - 8 A I BM Base current peak value - 12 A -I B(AV) Reverse base current average over any 20 ms period - 200 mA -I BM Reverse base current peak value 1 -7 A P tot Total power dissipation T hs ≤ 25 ˚C - 45 W T stg Storage temperature -65 150 ˚C T j Junction temperature - 150 ˚C THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT R th j-hs Junction to heatsink without heatsink compound - 3.7 K/W R th j-hs Junction to heatsink with heatsink compound - 2.8 K/W R th j-a Junction to ambient in free air 35 - K/W case 12 3 b c e Rbe 1 Turn-off current. September 1997 1 Rev 1.200 |
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