Data Sheet P14729EJ2V0DS00

25

µµµµPC8172TB

9. NOTE ON CORRECT USE

(1) Observe precautions for handling because of electrostatic sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

(3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin.

(4) Connect a matching circuit to the RF output pin.

(5) The DC cut capacitor must be each attached to the input and output pins.

10. RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and condi-

tions other than those recommended below, contact your NEC sales representative.

Soldering Method

Soldering Conditions

Recommended Condition Symbol

Infrared Reflow

Package peak temperature: 235

°C or below

Time: 30 seconds or less (at 210

°C)

Count: 3, Exposure limit: None

Note

IR35-00-3

VPS

Package peak temperature: 215

°C or below

Time: 40 seconds or less (at 200

°C)

Count: 3, Exposure limit: None

Note

VP15-00-3

Wave Soldering

Soldering bath temperature: 260

°C or below

Time: 10 seconds or less

Count: 1, Exposure limit: None

Note

WS60-00-1

Partial Heating

Pin temperature: 300

°C

Time: 3 seconds or less (per side of device)

Exposure limit: None

Note

−

Note After opening the dry pack, keep it in a place below 25

°C and 65% RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).