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UPC8172TB Datasheet(PDF) 3 Page - Renesas Technology Corp |
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UPC8172TB Datasheet(HTML) 3 Page - Renesas Technology Corp |
3 / 30 page ![]() Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. BIPOLAR ANALOG INTEGRATED CIRCUIT µµµµPC8172TB SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER Document No. P14729EJ2V0DS00 (2nd edition) Date Published September 2000 N CP(K) Printed in Japan DATA SHEET © 2000 The mark shows major revised points. DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conventional µPC8106TB, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications. FEATURES • Recommended operating frequency : fRFout = 0.8 to 2.5 GHz • Higher IP3 : CG = 9.5 dB TYP., OIP3 = +7.5 dBm TYP. @ fRFout = 0.9 GHz • High-density surface mounting : 6-pin super minimold package • Supply voltage : VCC = 2.7 to 3.3 V APPLICATIONS • PCS1900M • 2.4 GHz band transmitter/receiver system (wireless LAN etc.) ORDERING INFORMATION Part Number Package Marking Supplying Form µPC8172TB-E3 6-pin super minimold C3A • Embossed tape 8 mm wide. • Pin 1, 2, 3 face the tape perforation side. • Qty 3 kpcs/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC8172TB) |
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