CMPA2560025D

3

Rev. 2.3, 2022-12-13

© 2022 Wolfspeed, Inc. All rights reserved. Wolfspeed and the Wolfstreak logo are registered trademarks and the Wolfspeed logo is a trademark of Wolfspeed, Inc.

The information in this document is subject to change without notice.

4600 Silicon Drive | Durham, NC 27703 | Tel: +1.919.313.5300

DIE Dimensions (units in microns)

Assembly Notes

Overall die size 3680 x 4560 (+0/-50) microns, die thickness 100 (+/-10) microns.

All Gate and Drain pads must be wire bonded for electrical connection.

Notes:

1

Attach bypass capacitor to port 2-9 per application circuit

2

VG1_A and VG1_B is connected internally so it would be enough to connect either one for proper operation

3

The RF Input and Output pad have a ground-signal-ground with a pitch of 10 mil (250 um)

• Recommended solder is AuSn (80/20) solder. Refer to Wolfspeed’s website for the Eutectic Die Bond Procedure application note at

www.wolfspeed.com/rf/document-library

• Vacuum collet is the preferred method of pick-up

• The backside of the die is the Source (ground) contact

• Die back side gold plating is 5 microns thick minimum

• Thermosonic ball or wedge bonding are the preferred connection methods

• Gold wire must be used for connections

• Use the die label (XX-YY) for correct orientation

Pad Number

Function Description

Pad Size (microns)

Note

1

RF-IN

RF-Input pad. Matched to 50 ohm. Requires external blocking capacitor.

202 X 204

3

2

VG1_A

Gate control for stage 1. VG -1.5 - 2.5 V.

138 x 147

1, 2

3

VG1_B

4

VD1_A

Drain supply for stage 1. VD = 26 V.

167 x 225

1

5

VD1_B

6

VG2_A

Gate control for stage 2A. VG -1.5 - 2.5 V.

167 x 175

7

VG2_B

Gate control for stage 2B. VG -1.5 - 2.5 V.

8

VD2_A

Drain supply for stage 2A. VD = 26 V.

A

9

VD2_B

Drain supply for stage 2B. VD = 26 V.

10

RF-Out

This pad is DC blocked internally. The DC impedance ~ 0 ohm due

output matching circuit. Requires external matching circuit for optimal

performance for f >4.0 GHz.

252 x 204

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