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NCP1271 Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP1271 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 19 page NCP1271 http://onsemi.com 3 MAXIMUM RATINGS (Notes 1 and 2) Rating Symbol Value Unit VCC Pin (Pin 6) Maximum Voltage Range Maximum Current Vmax Imax −0.3 to +20 100 V mA Skip/Latch, FB, CS Pin (Pins 1−3) Maximum Voltage Range Maximum Current Vmax Imax −0.3 to +10 100 V mA Drv Pin (Pin 5) Maximum Voltage Range Maximum Current Vmax Imax −0.3 to +20 −800 to +500 V mA HV Pin (Pin 8) Maximum Voltage Range Maximum Current Vmax Imax −0.3 to +500 100 V mA Power Dissipation and Thermal Characteristics Thermal Resistance, Junction−to−Air, PDIP−7, Low Conductivity PCB (Note 3) Thermal Resistance, Junction−to−Lead, PDIP−7, Low Conductivity PCB Thermal Resistance, Junction−to−Air, PDIP−7, High Conductivity PCB (Note 4) Thermal Resistance, Junction−to−Lead, PDIP−7, High Conductivity PCB Thermal Resistance, Junction−to−Air, SO−7, Low Conductivity PCB (Note 3) Thermal Resistance, Junction−to−Lead, SO−7, Low Conductivity PCB Thermal Resistance, Junction−to−Air, SO−7, High Conductivity PCB (Note 4) Thermal Resistance, Junction−to−Lead, SO−7, High Conductivity PCB RqJA RqJL RqJA RqJL RqJA RqJL RqJA RqJL 142 57 120 56 177 75 136 69 °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W Operating Junction Temperature Range TJ −40 to +150 °C Maximum Storage Temperature Range Tstg −60 to +150 °C ESD Protection Human Body Model ESD Pins 1−6 Human Body Model ESD Pin 8 Machine Model ESD Pins 1−4, 8 Machine Model ESD Pins 5, 6 Charged Device Model ESD HBM HBM MM MM CDM 2000 700 200 150 1000 V V V V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. ESD protection per JEDEC JESD22−A114−F for HBM, per JEDEC JESD22−A115−A for MM, and per JEDEC JESD22−C101D for CDM. This device contains latchup protection and exceeds 100 mA per JEDEC Standard JESD78. 2. Guaranteed by design, not tested. 3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow. 4. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 650 mm2 of 2 oz copper traces and heat spreading area. As specified for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow. |
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