INA200 datasheet(2/19 Pages) BURR-BROWN

Part #	INA200

Description	High-Side Measurement Current-Shunt Monitor with Comparator and Reference

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Manufacturer	BURR-BROWN [Burr-Brown (TI)]

Direct Link	http://www.burr-brown.com

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INA200

INA201

INA202

SBOS374 − NOVEMBER 2006

www.ti.com

2

ABSOLUTE MAXIMUM RATINGS(1)

Supply Voltage, V+

18V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current-Shunt Monitor Analog Inputs, VIN+, VIN−

Differential (VIN+) − (VIN−)

−18V to +18V

. . . . . . . . . . . . . . . . . .

Common Mode(2)

−16V to +80V

. . . . . . . . . . . . . . . . . . . . . . . .

Comparator Analog Input and Reset Pins(2)

. . . . . . . . . . . . . . . . .

GND − 0.3V to (V+) + 0.3V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Analog Output, Out(2)

GND − 0.3V to (V+) + 0.3V

. . . . . . . . . . . . .

Comparator Output, Out Pin(2)

GND − 0.3V to 18V

. . . . . . . . . . . . .

Input Current Into Any Pin(2)

5mA

. . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature

−55

°C to +150°C

. . . . . . . . . . . . . . . . . . . . .

Storage Temperature

−65

°C to +150°C

. . . . . . . . . . . . . . . . . . . . . . .

Junction Temperature

+150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Ratings:

Human Body Model (HBM)

4000V

. . . . . . . . . . . . . . . . . . . . . . .

Charged Device Model (CDM)

1000V

. . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not supported.

(2) This voltage may exceed the ratings shown if the current at that

pin is limited to 5mA.

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

PRODUCT

GAIN

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

INA200

20V/V

MSOP-8

DGK

BQH

INA200

20V/V

SO-8(2)

D

INA200A

INA201

50V/V

MSOP-8

DGK

BQJ

INA201

50V/V

SO-8(2)

D

INA201A

INA202

100V/V

MSOP-8

DGK

BQL

INA202

100V/V

SO-8(2)

D

INA202A

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

(2) Available Q1, 2007.

PIN CONFIGURATIONS

1

2

3

4

8

7

6

5

V

IN+

V

IN

−

CMP

OUT

RESET

V+

OUT

CMP

IN

GND

INA200−INA202

MSOP−8 (DGK)

SO−8 (D)

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